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RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

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RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

Brand Name : Bicheng

Model Number : BIC-6.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Based material : AD1000

Layer count : 2L

Thickness : 50mil

Surface : Immersion Gold

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50mil AD1000 Immersion Gold RF PCB 1.27mm 2 Layer Circuit Boards

This style of PTFE/woven fiberglass/ceramic filled laminate AD1000 material is used to create immersion gold RF PCBs. The circuit board has finished 1oz copper in two layers. No silkscreen and solder mask. The layer is completely exposed in air. It is 50 vacuum-packed boards and the board thickness is 0.8mm.

AD1000 is widely use in Aircraft Collision Avoidance Systems (TCAS), Ground Based Radar Surveillance Systems, Low Noise Amplifiers (LNAs), Miniaturized Circuitry & Patch Antennas, Power Amplifiers (PAs), Radar Modules and Manifolds and X-Band and Below.

Typical property of AD1000

Property Units Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz - IPC TM-650 2.5.5.3
@ 10 GHz - 10.2 IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz - IPC TM-650 2.5.5.3
@ 10 GHz - 0.0023 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -
TCεr @ 10 GHz (-40-150°C) ppm/℃ -380 IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90 MΩ-cm 1.40x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 5.36x107 IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90 MΩ 1.80x109 IPC TM-650 2.5.17.1
E24/125 MΩ 3.16x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 622 (24.5) IPC TM-650 2.5.6.2
Dielectric Breakdown kV >45 IPC TM-650 2.5.6
Arc Resistance sec >180 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial ℃ >500 IPC TM-650 2.4.24.6
5% ℃ >500 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/℃ 8, 10 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/℃ 20 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress lb/in (N/mm) >12 (2.1) IPC TM-650 2.4.8
At Elevated Temperatures (150º) lb/in (N/mm) 13.6 (2.4) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) IPC TM-650 2.4.8
Young’s Modulus kpsi (GPa) 200 (1.38) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.9/7.5 (68/52) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.1/4.3 (35/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (GPa) >425 (>2.93) ASTM D-3410
Poisson’s Ratio - 0.16 ASTM D-3039
4. Physical Properties
Water Absorption % 0.03 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 3.20 ASTM D792 Method A
Thermal Conductivity W/mK 0.81 ASTM E1461
Flammability class Meets V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr % NASA SP-R-0022A
Total Mass Loss % 0.01 NASA SP-R-0022A
Collected Volatiles % 0.00 NASA SP-R-0022A
Water Vapor Recovered % 0.00 NASA SP-R-0022A

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold


Product Tags:

AD1000 RF PCB Board

      

1.27mm RF Circuit Boards

      

Immersion Gold PCB Circuit Boards

      
Wholesale RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold from china suppliers

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