In the demanding world of RF and microwave electronics, signal integrity and material stability are paramount. Our 2-layer rigid PCB, constructed with Wangling's advanced F4BM220 PTFE/fiberglass laminate, delivers exceptional high-frequency performance for critical communication and radar systems. With its ultra-low loss characteristics and precise dielectric properties, this PCB is engineered to meet the rigorous demands of modern RF applications.
Precision Construction & Key Specifications
Base Material: High-performance F4BM220 PTFE/fiberglass composite for superior RF characteristics
Layer Count: 2 layers with 4/6 mil trace/space capability
Board Dimensions: 130.5mm × 103mm (±0.15mm tolerance)
Minimum Hole Size: 0.3mm (mechanical drilling)
Finished Thickness: 1.7mm (1.575mm core with 35μm copper layers)
Surface Finish: ENIG (Electroless Nickel Immersion Gold) for reliable solderability
Via Plating Thickness: 20μm for durable interconnects
Electrical Testing: 100% tested prior to shipment
Optimized Stackup for RF Performance
The 2-layer stackup is carefully engineered for maximum signal integrity:
Top Layer: 35μm ED copper foil
Core: 1.575mm F4BM220 laminate (PTFE/fiberglass composite)
Bottom Layer: 35μm ED copper foil
Special Design Considerations:
No solder mask or silkscreen to minimize dielectric interference
All vias are through-hole (no blind/buried vias)
Clean surface finish for optimal RF performance
Why Choose F4BM220 Material?
Superior High-Frequency Characteristics
Dielectric Constant (Dk): 2.2±0.04 @ 10GHz - exceptional stability for precise impedance control
Ultra-Low Loss: Dissipation Factor (Df) of 0.001 at 10GHz for minimal signal degradation
Thermal Stability: CTE of 25ppm/°C (x-axis), 34ppm/°C (y-axis) for dimensional reliability
Moisture Resistance: Absorption ≤0.08% for consistent performance in varied environments
Enhanced Reliability Features
UL-94 V0 flammability rating for safety compliance
Excellent temperature resistance (-55°C to 288°C operating range)
Thermal coefficient of Dk: -142ppm/°C (-55°C to 150°C) for stable performance
Ideal Applications
This PCB is specifically designed for high-frequency applications including:
Microwave and RF communication systems
Phase shifters and power dividers
Satellite communication equipment
Base station antennas and feed networks
Radar systems and phased array antennas
Couplers and combiners
Quality Assurance & Global Availability
We maintain strict quality standards to ensure reliable performance:
Compliant with IPC-Class-2 standards
Accepts Gerber RS-274-X artwork files
Worldwide availability with reliable shipping options
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F4BM220 PCB 2 Layer 1.575mm 1oz Copper ENIG Finished Images
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