This hybrid PCB utilizes Rogers RO4350B high-frequency laminates combined with a High Tg 170°C FR-4 as its material, ensuring excellent performance and structural stability. It is equipped with ENIG surface finish, green solder mask, and white silkscreen configuration, complemented by precise dimensional control and strict quality standards to fulfill the requirements of high-reliability electronic applications.
PCB Details
| Construction Parameter | Specification |
| Base material | RO4350B + High Tg 170°C FR-4 |
| Layer count | 4-layer |
| Board dimensions | 35mm x 25mm per piece, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.30mm |
| Vias | Blind vias between Layer 3 (L3) and Layer 4 (L4) |
| Finished board thickness | 1.55mm |
| Finished Cu weight | 1oz (1.4 mils) for both inner and outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Electroless Nickle Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Impedance control | 50ohm (Top side), 5/8mil differential pairs |
| Quality test | 100% Electrical test conducted prior to shipment |
PCB Stack-up
This is a 4-layer rigid PCB, with the stack-up structure (from top to bottom) as follows:
| Layer Type | Specification (From Top to Bottom) |
| Copper Layer | Copper_layer_1: 35 μm |
| Dielectric Layer | RO4350B: 0.254 mm (10mil) |
| Copper Layer | Copper_layer_2: 35 μm |
| Prepreg Layer | 1080 RC63% |
| Prepreg Layer | 7628 (43%) |
| Core Layer | High Tg 170°C FR-4: 0.4mm |
| Prepreg Layer | 1080 RC63% |
| Prepreg Layer | 7628 (43%) |
| Copper Layer | Copper_layer_3: 35 μm |
| Dielectric Layer | RO4350B: 0.254 mm (10mil) |
| Copper Layer | Copper_layer_4: 35 μm |
Artwork Type
To ensure accurate and efficient PCB manufacturing, the artwork supplied for this PCB is in Gerber RS-274-X format, which is the industry-standard file format for PCB fabrication.
Quality Standard
This PCB is manufactured and inspected in strict compliance with the IPC-Class-2 standard, a widely adopted industry standard for printed circuit boards. IPC-Class-2 specifies requirements for general electronic products, ensuring reliable performance in typical applications.
Availability
This PCB is offered globally, with a stable supply capability to accommodate diverse order requirements—ranging from small-batch prototypes to large-scale mass production—backed by efficient logistics solutions to ensure timely global delivery.
Introduction to RO4350B Material
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics, featuring electrical performance close to PTFE/woven glass and the manufacturability of epoxy/glass.
RO4350B laminates offer tight control over dielectric constant (Dk) and maintain low loss while using the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require special through-hole treatments or handling procedures unlike PTFE-based materials. These materials are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs.
The thermal coefficient of expansion (CTE) of RO4350B material provides several key benefits to circuit designers. Its expansion coefficient is similar to that of copper, ensuring excellent dimensional stability— a critical property for mixed dielectric multi-layer board constructions. The low Z-axis CTE of RO4350B laminates ensures reliable plated through-hole quality, even in severe thermal shock applications. Additionally, RO4350B material has a Tg of >280°C (536°F), so its expansion characteristics remain stable over the entire range of circuit processing temperatures.
Features of RO4350B Material
| Material Property | Specification |
| Dielectric Constant (Dk) | 3.48 +/-0.05 at 10GHz/23°C |
| Dissipation Factor | 0.0037 at 10GHz/23°C |
| Thermal Conductivity | 0.69 W/m/°K |
| Coefficient of Thermal Expansion (CTE) | X axis 10 ppm/°C, Y axis 12 ppm/°C, Z axis 32 ppm/°C |
| High Tg value | >280 °C |
| Low water absorption | 0.06% |
Typical Applications
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas
Summary
With low signal loss, excellent dimensional stability and reliable structural performance, this 4-layer PCB is an ideal solution for engineers, electronic product manufacturers and RF system integrators pursuing high reliability and stable signal transmission, effectively meeting the high-performance requirements of high-frequency applications including airborne communication, millimeter-wave systems, radar and guidance systems.
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Hybrid PCB on RO4350B and High TG FR4 material 4-layer Blind Vias Images
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